REIMA Annual Conference 2019

2nd International Conference on Recent Advances in Engineering, Image Processing, Manufacturing & Applied Sciences

REIMA-2019
Osaka, Japan

Conference Theme
Forum for enhancement of research and developmental activities through networking and sharing ideas.

Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.

Publications:
All papers for the conference will be published in the Journal volume, and one Excellent Paper will be selected from each oral session.

Main Tracks of the conferences but not limited to:

  • Mechanical & Industrial Engineering
  • Electrical and Electronics Engineering
  • Physics
  • Chemistry
  • ICT
  • Civil Engineering
  • Management
  • Oil, Gas, Energy & Mining Engineering
  • Basic Sciences
  • Applied Sciences

Important Information

Conference Date: Nov 30-Dec 01, 2019
Abstract Submission Date: November 20, 2019
Full Paper Submission Date: November 20, 2019
Early Bird Date: October 15,2019
Manuscript Id: reima@consortium-et.com
Conference Venue: Hotel MyStays Shin-Osaka Conference Center

Conference Venue
Hotel MyStays Shin-Osaka Conference Center
Address: 6 Chome-2-19 Nishinakajima, Yodogawa Ward, Osaka, Osaka Prefecture 532-0011, Japan
Phone: +81 6-6302-5571