REIMA Annual Conference 2020

3rd International Conference on Recent Advances in Engineering, Image Processing, Manufacturing & Applied Sciences

REIMA-2020
Osaka, Japan

Conference Theme
Providing Platform for enhancement of research and developmental activities through networking.

Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.

Publications:
All papers for the conference will be published in the Journal volume, and one Excellent Paper will be selected from each oral session.

Main Tracks of the conferences but not limited to:

  • Mechanical & Industrial Engineering
  • Electrical and Electronics Engineering
  • Physics
  • Chemistry
  • ICT
  • Civil Engineering
  • Management
  • Oil, Gas, Energy & Mining Engineering
  • Basic Sciences
  • Applied Sciences

Important Information

Conference Date: November 21-22, 2020
Abstract Submission Date: November 13, 2020
Full Paper Submission Date: November 11, 2020
Early Bird Date: October 20, 2020
Manuscript Id: reima@consortium-et.com
Conference Venue: Hotel MyStays Shin-Osaka Conference Center

Conference Venue
Hotel MyStays Shin-Osaka Conference Center
Address: 6 Chome-2-19 Nishinakajima, Yodogawa Ward, Osaka, Osaka Prefecture 532-0011, Japan
Phone: +81 6-6302-5571